中国新歌声
180 iron nails along with magnets and other objects removed from a man’s stomach, weighing more than 1 kg in total: media_我的网站

A | 8月24日消息,美光HBM设计架构研究员拉古·斯里拉马内尼在8月23日斯坦福大学举办的Hot Chips 2026半导体会议上警告,内存墙依然存在,且情况还在恶化。 所谓内存墙,是指GPU速度不断提升,但存储数据的高带宽内存却无法跟上其速度而导致的瓶颈。

180 iron nails and other foreign objects, including coins, screws, nuts and magnets have recently been removed by doctors at a hospital in Southwest China’s Yunnan Province from a local man’s stomach after he sought treatment for repeated vomiting and abdominal pain, Yunnan Daily reported on Sunday.
The man’s family took him to The Third People’s Hospital of Yunnan Province for examination. Imaging scans revealed a large mass of metal objects in the man’s abdomen, which had clumped together, distended his stomach and caused it to drop downward, according to the report.
The nearly three-hour surgery on Friday removed foreign objects weighing more than 1 kilogram, including a nail nearly 10 centimeters long.
According to Li Wei, chief physician from the hepatobiliary and pancreatic surgery department at the hospital, the patient’s stomach was covered with ulcers and erosions, but fortunately the nails did not perforate the stomach or enter the intestines. The magnets may have caused the nails to clump together, with some nails becoming magnetized. The patient is recovering well and remains in stable condition.
Doctors at the hospital have previously treated patients who swallowed nails, wires and lighters, but this was their first case involving 180 nails.
The man’s family members told Jimu News, a news portal under Hubei Daily, that he had a long history of mental illness and nobody knew why he swallowed so many nails.
Li warns that people should not assume that small swallowed objects will pass on their own, particularly when they are metal or sharp. Such objects can become lodged in narrow sections of the digestive tract and cause injuries or perforation, potentially leading to peritonitis and life-threatening complications.
Global Times
。 会议展示的最新HBM封装技术上,两颗GPU与八颗12层HBM4集成于一体,其中约90%半导体面积都用于存储,存储面积是GPU的8倍多。

B | 芯片内部空间几乎全被存储占据,这正是用面积换带宽所付出的代价,也是内存墙问题日益严峻的直观体现。

C |
拉古指出,AI加速器计算性能以每两年3倍速度发展,但同期HBM发展速度不到每两年2倍。这解释了高带宽内存为何还是喂不饱GPU,无论计算设备速度多快,数据通道狭窄终将因供给过慢而停滞。 硬件上,当前HBM制造相同存储容量消耗的晶圆数量约为普通DDR5的3倍。拉古强调,技术升级越快芯片尺寸越大、堆叠层数越多,这一差距还在扩大,内存行业将持续面临短缺。 散热方面,HBM是多层堆叠结构,底层产生的热量最多,但热量必须穿透所有堆叠层才能到达顶部的冷却系统,这使得散热效率大打折扣,液冷和芯片超薄技术正提供解决方案。 拉古表示,HBM的挑战需要内存厂商、GPU设计商、代工厂和封装厂商共同协作才能解决。
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